上(shang)海新(xin)(xin)昇半導(dao)體科技有限(xian)公司成立于2014年,是上(shang)海硅(gui)產(chan)業(ye)(ye)集團股份有限(xian)公司(滬硅(gui)產(chan)業(ye)(ye),股票代碼(ma):688126)全資(zi)控股子公司,坐落于中(zhong)國(上(shang)海)自由貿易(yi)試驗區臨港新(xin)(xin)片(pian)(pian)區,是商業(ye)(ye)化提供300mm(12英寸)半導(dao)體硅(gui)片(pian)(pian)的中(zhong)國企業(ye)(ye)。
半導(dao)體(ti)(ti)硅片(pian)是集(ji)(ji)成電路(lu)行業(ye)的(de)糧食,是基(ji)礎(chu)的(de)集(ji)(ji)成電路(lu)材料(liao),90%的(de)集(ji)(ji)成電路(lu)在硅片(pian)上制造(zao),目前300mm硅片(pian)已成為芯片(pian)制造(zao)的(de)主(zhu)流材料(liao),使用比例(li)超過70%。過去(qu)我(wo)國(guo)300mm半導(dao)體(ti)(ti)硅片(pian)100%依(yi)賴進口,成為我(wo)國(guo)集(ji)(ji)成電路(lu)產(chan)業(ye)鏈建設(she)與發展的(de)主(zhu)要(yao)瓶頸。
為實(shi)現300mm半導(dao)體(ti)硅(gui)片(pian)(pian)自(zi)主(zhu)可控的(de)(de)國(guo)家戰(zhan)略,上海(hai)新昇(sheng)半導(dao)體(ti)科技(ji)有限公(gong)(gong)司先(xian)后承(cheng)擔國(guo)家科技(ji)重(zhong)大(da)專(zhuan)項02專(zhuan)項系列攻關任(ren)務(wu),開(kai)發出(chu)先(xian)進(jin)(jin)邏(luo)輯(ji)電路和(he)先(xian)進(jin)(jin)存儲器應用的(de)(de)300mm硅(gui)片(pian)(pian)晶體(ti)生長與晶圓成(cheng)型成(cheng)套工藝技(ji)術,并成(cheng)功實(shi)現產(chan)(chan)(chan)業化(hua)。目前已(yi)建設完成(cheng)30萬片(pian)(pian)月(yue)產(chan)(chan)(chan)能的(de)(de)生產(chan)(chan)(chan)線,累計實(shi)現銷售達到600萬片(pian)(pian)。有效化(hua)解(jie)了300mm硅(gui)片(pian)(pian)“卡(ka)脖子”風險,打破我(wo)國(guo)300mm硅(gui)片(pian)(pian)依賴進(jin)(jin)口的(de)(de)局面(mian),滿足國(guo)家重(zhong)大(da)需求,為中(zhong)國(guo)的(de)(de)集成(cheng)電路產(chan)(chan)(chan)業做出(chu)了重(zhong)大(da)貢獻。公(gong)(gong)司生產(chan)(chan)(chan)的(de)(de)300mm硅(gui)片(pian)(pian)廣(guang)泛用于存儲器芯片(pian)(pian)、邏(luo)輯(ji)芯片(pian)(pian)、圖像傳感(gan)器、IGBT功率器件及通信芯片(pian)(pian)等集成(cheng)電路產(chan)(chan)(chan)業。
為充分滿(man)足(zu)我國集(ji)(ji)成(cheng)電(dian)(dian)(dian)路(lu)產(chan)業對(dui)硅襯底材料(liao)的迫切需求,解決大硅片(pian)(pian)的自(zi)主可控問題(ti)。2022年,上(shang)(shang)海(hai)新(xin)(xin)昇(sheng)與多個合資(zi)(zi)方共同出資(zi)(zi)逐(zhu)級(ji)(ji)設(she)立(li)一(yi)級(ji)(ji)、二級(ji)(ji)、三級(ji)(ji)控股子(zi)(zi)公(gong)司(si),在(zai)上(shang)(shang)海(hai)臨(lin)港建設(she)新(xin)(xin)增30萬片(pian)(pian)“集(ji)(ji)成(cheng)電(dian)(dian)(dian)路(lu)用300mm高端硅片(pian)(pian)研發與先(xian)(xian)進(jin)(jin)(jin)(jin)制(zhi)造(zao)項目(mu)”,新(xin)(xin)設(she)立(li)二級(ji)(ji)子(zi)(zi)公(gong)司(si)上(shang)(shang)海(hai)新(xin)(xin)昇(sheng)晶(jing)科半(ban)導(dao)體(ti)科技有限(xian)(xian)公(gong)司(si)將承(cheng)擔“集(ji)(ji)成(cheng)電(dian)(dian)(dian)路(lu)制(zhi)造(zao)用300mm高端硅片(pian)(pian)研發與先(xian)(xian)進(jin)(jin)(jin)(jin)制(zhi)造(zao)項目(mu)”中切磨拋產(chan)線建設(she),另設(she)立(li)三級(ji)(ji)子(zi)(zi)公(gong)司(si)上(shang)(shang)海(hai)新(xin)(xin)昇(sheng)晶(jing)睿半(ban)導(dao)體(ti)科技有限(xian)(xian)公(gong)司(si)將承(cheng)擔“集(ji)(ji)成(cheng)電(dian)(dian)(dian)路(lu)制(zhi)造(zao)用300mm單晶(jing)硅棒(bang)晶(jing)體(ti)生長(chang)研發與先(xian)(xian)進(jin)(jin)(jin)(jin)制(zhi)造(zao)項目(mu)”中的拉晶(jing)產(chan)線建設(she)兩部(bu)分。項目(mu)建成(cheng)后,上(shang)(shang)海(hai)新(xin)(xin)昇(sheng)集(ji)(ji)成(cheng)電(dian)(dian)(dian)路(lu)用300mm半(ban)導(dao)體(ti)硅片(pian)(pian)總產(chan)能達到60萬片(pian)(pian)/月,進(jin)(jin)(jin)(jin)一(yi)步(bu)夯(hang)實業務基(ji)礎、提高市場(chang)占有率。