ic芯片(pian)的概念

IC芯(xin)片(pian)(pian)(Integrated Circuit 集(ji)成(cheng)電(dian)(dian)路)是將大(da)量的(de)微(wei)電(dian)(dian)子元(yuan)器(qi)件(晶體管、電(dian)(dian)阻、電(dian)(dian)容、二極管等) 形成(cheng)的(de)集(ji)成(cheng)電(dian)(dian)路放(fang)在(zai)一(yi)塊塑基上(shang)，做成(cheng)一(yi)塊芯(xin)片(pian)(pian)。目前幾乎所有(you)看到(dao)的(de)芯(xin)片(pian)(pian)，都可以叫(jiao)做IC芯(xin)片(pian)(pian)。　 　　

集(ji)成(cheng)電(dian)(dian)路(lu)（integrated circuit）是一(yi)(yi)種微型電(dian)(dian)子器件(jian)(jian)或部(bu)件(jian)(jian)。采用(yong)(yong)一(yi)(yi)定(ding)的(de)(de)(de)工藝，把(ba)一(yi)(yi)個(ge)(ge)電(dian)(dian)路(lu)中(zhong)所(suo)需(xu)的(de)(de)(de)晶(jing)體管、二極管、電(dian)(dian)阻、電(dian)(dian)容和電(dian)(dian)感等元件(jian)(jian)及布線互連一(yi)(yi)起，制作在(zai)一(yi)(yi)小(xiao)塊或幾小(xiao)塊半(ban)導體晶(jing)片(pian)或介質基(ji)片(pian)上(shang)，然后封裝在(zai)一(yi)(yi)個(ge)(ge)管殼(ke)內(nei)，成(cheng)為具有(you)所(suo)需(xu)電(dian)(dian)路(lu)功(gong)(gong)能(neng)的(de)(de)(de)微型結構；其中(zhong)所(suo)有(you)元件(jian)(jian)在(zai)結構上(shang)已組成(cheng)一(yi)(yi)個(ge)(ge)整體，使電(dian)(dian)子元件(jian)(jian)向著微小(xiao)型化、低功(gong)(gong)耗和高可靠(kao)性方面(mian)邁進(jin)了一(yi)(yi)大步。它在(zai)電(dian)(dian)路(lu)中(zhong)用(yong)(yong)字(zi)母“IC”表示。集(ji)成(cheng)電(dian)(dian)路(lu)發(fa)明者為杰克·基(ji)爾比（基(ji)于硅的(de)(de)(de)集(ji)成(cheng)電(dian)(dian)路(lu)）和羅(luo)伯特(te)·諾伊思（基(ji)于鍺(zang)的(de)(de)(de)集(ji)成(cheng)電(dian)(dian)路(lu)）。當今半(ban)導體工業大多(duo)數應用(yong)(yong)的(de)(de)(de)是基(ji)于硅的(de)(de)(de)集(ji)成(cheng)電(dian)(dian)路(lu)。

現在行業內都會把集成(cheng)電路叫做(zuo)ic芯片