電路板的材質是什么

印刷電路板的(de)(de)(de)主要材(cai)料是覆銅(tong)(tong)(tong)(tong)板(ban)(ban)(ban)，而(er)覆銅(tong)(tong)(tong)(tong)板(ban)(ban)(ban)（敷銅(tong)(tong)(tong)(tong)板(ban)(ban)(ban)）是由(you)基(ji)(ji)板(ban)(ban)(ban)、銅(tong)(tong)(tong)(tong)箔和粘合(he)劑構成(cheng)的(de)(de)(de)。基(ji)(ji)板(ban)(ban)(ban)是由(you)高(gao)分子合(he)成(cheng)樹(shu)脂和增強材(cai)料組成(cheng)的(de)(de)(de)絕緣層板(ban)(ban)(ban)；在基(ji)(ji)板(ban)(ban)(ban)的(de)(de)(de)表面(mian)(mian)(mian)覆蓋(gai)著一(yi)層導電率較高(gao)、焊接(jie)性(xing)良好的(de)(de)(de)純銅(tong)(tong)(tong)(tong)箔，常(chang)用厚度35～50／ma；銅(tong)(tong)(tong)(tong)箔覆蓋(gai)在基(ji)(ji)板(ban)(ban)(ban)一(yi)面(mian)(mian)(mian)的(de)(de)(de)覆銅(tong)(tong)(tong)(tong)板(ban)(ban)(ban)稱為單面(mian)(mian)(mian)覆銅(tong)(tong)(tong)(tong)板(ban)(ban)(ban)，基(ji)(ji)板(ban)(ban)(ban)的(de)(de)(de)兩面(mian)(mian)(mian)均覆蓋(gai)銅(tong)(tong)(tong)(tong)箔的(de)(de)(de)覆銅(tong)(tong)(tong)(tong)板(ban)(ban)(ban)稱雙面(mian)(mian)(mian)覆銅(tong)(tong)(tong)(tong)板(ban)(ban)(ban)；銅(tong)(tong)(tong)(tong)箔能否牢固地覆在基(ji)(ji)板(ban)(ban)(ban)上，則(ze)由(you)粘合(he)劑來(lai)完成(cheng)。常(chang)用覆銅(tong)(tong)(tong)(tong)板(ban)(ban)(ban)的(de)(de)(de)厚度有1.0mm、1.5mm和2.0mm三種。

該圖片由注冊用戶"壯志凌云"提供，版權聲明反饋

常用的覆銅板種類有哪些

覆銅板的種(zhong)類也(ye)較多。按絕緣材(cai)料不同(tong)可分為(wei)(wei)紙(zhi)基板、玻璃(li)布基板和(he)合成(cheng)纖維(wei)板；按粘結劑(ji)樹脂不同(tong)又(you)分為(wei)(wei)酚醛、環氧、聚(ju)脂和(he)聚(ju)四氟乙烯等；按用途可分為(wei)(wei)通用型和(he)特殊型。

（1）覆銅箔酚醛紙層(ceng)壓板

是由絕緣浸漬(zi)紙(zhi)（TFz一62）或(huo)棉纖維浸漬(zi)紙(zhi)（1TZ-一63）浸以酚醛樹(shu)脂經熱壓(ya)而(er)成的(de)層壓(ya)制(zhi)品，兩(liang)表面膠紙(zhi)可附以單(dan)張無堿玻璃浸膠布，其一面敷以銅箔。主(zhu)要用作無線電設備中的(de)印(yin)制(zhi)電路板(ban)。

（2）覆銅(tong)箔酚醛玻璃(li)布層壓板

是用無堿玻璃布浸以環氧酚醛樹脂經熱壓而成的層壓制品，其一面或雙面敷以銅箔，具有質輕、電氣和機械性能良好、加工方便等優點。其板面呈淡黃色，若用三氰二胺作固化劑，則板面呈淡綠色，具有良好的透明度。主要在工作溫度和工作頻率較高的無線電設備中用作印制電路板。

（3）覆銅箔聚(ju)四氟(fu)乙烯層壓板

是以(yi)聚(ju)四氟乙(yi)烯板(ban)為(wei)基板(ban)，敷以(yi)銅(tong)箔(bo)經(jing)熱(re)壓而成的(de)一種敷銅(tong)板(ban)。主要(yao)用(yong)于高頻和超高頻線(xian)路中作印(yin)制(zhi)板(ban)用(yong)。

（4）覆銅箔(bo)環(huan)氧玻璃布層壓(ya)板

是孔(kong)金屬(shu)化印制板常用的(de)材(cai)料。

（5）軟性聚酯敷銅薄膜

是(shi)用(yong)聚酯薄膜與銅(tong)熱壓而成(cheng)的(de)帶狀材料，在應(ying)用(yong)中將(jiang)它卷曲成(cheng)螺旋(xuan)形(xing)狀放在設備內部(bu)。為(wei)了加固或(huo)防潮，常以環氧樹脂將(jiang)它灌(guan)注成(cheng)一個整體。主要(yao)用(yong)作柔性印制電路和印制電纜，可作為(wei)接插件的(de)過渡線。目前，市場(chang)上供應(ying)的(de)覆銅(tong)板(ban)，從(cong)基(ji)材考慮，主要(yao)可分以下(xia)幾(ji)類：紙基(ji)板(ban)、玻纖布基(ji)板(ban)、合(he)成(cheng)纖維布基(ji)板(ban)、無紡布基(ji)板(ban)、復合(he)基(ji)板(ban)。

覆銅板常用制作材料有哪些

FR-1──酚(fen)醛棉(mian)紙，這基(ji)材通(tong)稱電木板（比FR-2較(jiao)高經濟性）

FR-2──酚(fen)醛棉紙

FR-3──棉紙（Cotton paper）、環氧(yang)樹脂

FR-4──玻璃布（Woven glass）、環(huan)氧樹脂

FR-5──玻璃布、環(huan)氧(yang)樹(shu)脂

FR-6──毛面(mian)玻璃、聚酯

G-10──玻璃布、環氧樹脂

CEM-1──棉紙、環氧樹脂（阻(zu)燃(ran)）

CEM-2──棉紙、環氧樹脂（非(fei)阻燃）

CEM-3──玻璃布、環氧樹脂

CEM-4──玻璃布、環氧樹脂

CEM-5──玻璃布、多元酯

AIN──氮(dan)化鋁

SIC──碳化硅