電路板的材質是什么

印刷電路板的(de)(de)(de)主要(yao)材(cai)料是(shi)覆(fu)(fu)(fu)(fu)銅(tong)(tong)(tong)板(ban)(ban)(ban)(ban)(ban)(ban)，而覆(fu)(fu)(fu)(fu)銅(tong)(tong)(tong)板(ban)(ban)(ban)(ban)(ban)(ban)（敷(fu)銅(tong)(tong)(tong)板(ban)(ban)(ban)(ban)(ban)(ban)）是(shi)由(you)基(ji)板(ban)(ban)(ban)(ban)(ban)(ban)、銅(tong)(tong)(tong)箔(bo)(bo)和(he)(he)粘合劑構(gou)成的(de)(de)(de)。基(ji)板(ban)(ban)(ban)(ban)(ban)(ban)是(shi)由(you)高(gao)分子合成樹脂(zhi)和(he)(he)增強材(cai)料組(zu)成的(de)(de)(de)絕緣層板(ban)(ban)(ban)(ban)(ban)(ban)；在基(ji)板(ban)(ban)(ban)(ban)(ban)(ban)的(de)(de)(de)表面(mian)覆(fu)(fu)(fu)(fu)蓋(gai)著(zhu)一(yi)層導電率較高(gao)、焊接性良好(hao)的(de)(de)(de)純銅(tong)(tong)(tong)箔(bo)(bo)，常(chang)用厚度(du)35～50／ma；銅(tong)(tong)(tong)箔(bo)(bo)覆(fu)(fu)(fu)(fu)蓋(gai)在基(ji)板(ban)(ban)(ban)(ban)(ban)(ban)一(yi)面(mian)的(de)(de)(de)覆(fu)(fu)(fu)(fu)銅(tong)(tong)(tong)板(ban)(ban)(ban)(ban)(ban)(ban)稱(cheng)為單面(mian)覆(fu)(fu)(fu)(fu)銅(tong)(tong)(tong)板(ban)(ban)(ban)(ban)(ban)(ban)，基(ji)板(ban)(ban)(ban)(ban)(ban)(ban)的(de)(de)(de)兩面(mian)均覆(fu)(fu)(fu)(fu)蓋(gai)銅(tong)(tong)(tong)箔(bo)(bo)的(de)(de)(de)覆(fu)(fu)(fu)(fu)銅(tong)(tong)(tong)板(ban)(ban)(ban)(ban)(ban)(ban)稱(cheng)雙面(mian)覆(fu)(fu)(fu)(fu)銅(tong)(tong)(tong)板(ban)(ban)(ban)(ban)(ban)(ban)；銅(tong)(tong)(tong)箔(bo)(bo)能否牢(lao)固地覆(fu)(fu)(fu)(fu)在基(ji)板(ban)(ban)(ban)(ban)(ban)(ban)上，則由(you)粘合劑來完(wan)成。常(chang)用覆(fu)(fu)(fu)(fu)銅(tong)(tong)(tong)板(ban)(ban)(ban)(ban)(ban)(ban)的(de)(de)(de)厚度(du)有1.0mm、1.5mm和(he)(he)2.0mm三種。

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常用的覆銅板種類有哪些

覆銅板(ban)的種類也較多。按(an)絕(jue)緣材(cai)料不(bu)同可(ke)分(fen)為(wei)紙基板(ban)、玻璃布基板(ban)和(he)合(he)成纖維板(ban)；按(an)粘結劑(ji)樹脂不(bu)同又分(fen)為(wei)酚醛、環氧、聚脂和(he)聚四氟乙烯等；按(an)用途可(ke)分(fen)為(wei)通用型和(he)特(te)殊型。

（1）覆銅箔(bo)酚醛紙(zhi)層壓板

是(shi)由(you)絕(jue)緣浸(jin)(jin)漬紙（TFz一(yi)62）或(huo)棉(mian)纖維浸(jin)(jin)漬紙（1TZ-一(yi)63）浸(jin)(jin)以(yi)酚醛樹(shu)脂經熱壓而成的層壓制品，兩表(biao)面(mian)(mian)膠紙可(ke)附以(yi)單張無堿玻璃浸(jin)(jin)膠布，其一(yi)面(mian)(mian)敷以(yi)銅箔。主要(yao)用作無線(xian)電設備中的印制電路板(ban)。

（2）覆銅(tong)箔酚醛玻璃布層(ceng)壓板

是用無堿玻璃布浸以環氧酚醛樹脂經熱壓而成的層壓制品，其一面或雙面敷以銅箔，具有質輕、電氣和機械性能良好、加工方便等優點。其板面呈淡黃色，若用三氰二胺作固化劑，則板面呈淡綠色，具有良好的透明度。主要在工作溫度和工作頻率較高的無線電設備中用作印制電路板。

（3）覆銅箔聚(ju)四(si)氟乙烯(xi)層壓(ya)板

是以聚四氟乙烯板為基(ji)板，敷以銅箔經熱壓而成(cheng)的一(yi)種敷銅板。主要用于高頻(pin)和(he)超高頻(pin)線路中作印(yin)制板用。

（4）覆銅箔環氧玻璃布層壓板

是孔(kong)金屬化印制板常用的(de)材(cai)料。

（5）軟性聚(ju)酯敷銅薄(bo)膜

是用聚酯薄(bo)膜與銅(tong)熱壓而成(cheng)的(de)(de)(de)帶(dai)狀(zhuang)材料，在應用中將(jiang)它(ta)卷曲(qu)成(cheng)螺(luo)旋形狀(zhuang)放在設備內部。為了加固或防潮，常(chang)以環氧樹脂將(jiang)它(ta)灌注(zhu)成(cheng)一個整體。主要用作柔性(xing)印制(zhi)電(dian)路和(he)印制(zhi)電(dian)纜，可作為接(jie)插件的(de)(de)(de)過渡線。目前，市(shi)場上供應的(de)(de)(de)覆(fu)銅(tong)板(ban)，從基(ji)(ji)材考慮，主要可分以下幾(ji)類：紙基(ji)(ji)板(ban)、玻纖布基(ji)(ji)板(ban)、合成(cheng)纖維布基(ji)(ji)板(ban)、無(wu)紡布基(ji)(ji)板(ban)、復合基(ji)(ji)板(ban)。

覆銅板常用制作材料有哪些

FR-1──酚醛棉(mian)紙，這基材通稱(cheng)電木板（比FR-2較高經濟性）

FR-2──酚醛棉紙

FR-3──棉紙(zhi)（Cotton paper）、環氧樹脂

FR-4──玻璃布(bu)（Woven glass）、環氧樹脂

FR-5──玻璃布、環氧樹脂

FR-6──毛面玻璃(li)、聚(ju)酯

G-10──玻(bo)璃布、環氧樹脂

CEM-1──棉紙、環氧樹脂（阻燃）

CEM-2──棉(mian)紙(zhi)、環氧樹(shu)脂（非阻燃(ran)）

CEM-3──玻璃布、環氧樹脂

CEM-4──玻璃(li)布(bu)、環氧樹脂

CEM-5──玻璃布(bu)、多元酯

AIN──氮化鋁

SIC──碳化硅